GaAs chips and GaN transistors customization
20 Years of MMIC Design and Fabrication
Factory facilities and production test equipment
uA self-owned independent factory of 6,000 square meters, including 2,200 square meters of workshops, including 1,200 square meters of class 1,000/class 10,000 clean workshops
u10 automatic/manual probe stations, wafer cutting machine, automatic pick-up machine, automatic bonding machine, automatic placement machine, parallel sealing and welding machine, vacuum eutectic soldering furnace, tension/shear machine, X-ray machine , ultrasonic scanning SAT, coarse/fine leak detectors, PIND, microwave test instruments, a total of more than 300 sets
uAbility to deliver 4 million bare chips and 500,000 ceramic package products per year
Jintao packaging product production capacity
Features:
Experienced design simulation capabilities
Complete production equipment
Possessing traditional packaging and advanced packaging production capabilities
Automated production process
 |
 |
 |
 |
|
Automatic microwave probe station |
Automatic wafer sorter |
Plasma cleaning machine |
Automatic dispensing eutectic patch machine |
 |
 |
 |
 |
|
Automatic microwave probe station |
Automatic wafer sorter |
Plasma cleaning machine |
Automatic dispensing eutectic patch machine |
Jintao packaging product inspection capabilities
 |
 |
 |
 |
 |
|
ESD HBM/CDM |
High magnification metallographic microscope |
Push and pull force tester |
Fluorine oil and helium pressurization device |
Fluorine oil rough leak detection |
 |
 |
 |
 |
|
Helium fine leak detection |
PIND particle collision (excess detection) |
X-Ray fluoroscopy |
SAT Ultrasound |
Bare chip reliability testing
Created on：2025-03-11
ꄘPV：0
